Offer | MultiMEMS Dice
MultiMEMS Dice
MultiMEMS Dice Specifications
(PDF file, 130 KB)
Specifications
Infineon Technologies SensoNor offers the possibility to manufacture prototypes of MEMS designs, known as MultiMEMS Dice, in four different chip/die sizes, as listed in the table below.
| PRODUCT ID | WIDTH | LENGTH | |
|---|---|---|---|
| MultiMEMS Die 3x3 | 3.0 mm | 3.0 mm | |
| MultiMEMS Die 6x3 | 6.0 mm | 3.0 mm | |
| MultiMEMS Die 3x6 | 3.0 mm | 6.0 mm | |
| MultiMEMS Die 6x6 | 6.0 mm | 6.0 mm |
Except for the total width and length, all the MultiMEMS dice have identical geometry, with the wire-bond pads placed in the right-hand side of the chip. For more information, please download the MultiMEMS Dice Specifications file or consult the Design Handbook, Section 3-6.
 MultiMEMS die, schematic representation. © 2006 Infineon Technologies SensoNor. |
How to Order
To place an order with Infineon Technology SensoNor for manufacturing MultiMEMS dice, go to MPW Booking Form
page and follow the instructions.
NOTE: To access the MultiMEMS MPW service, the users need to follow the procedure described in the 
How to Access page.
MultiMEMS Dice Specifications
(PDF file, 130 KB)